Test Engineer-(ICT, Functional, and RF testing)

Summary

The Lead Engineer, Test Manufacturing accepts, transfers, installs, improves and maintains automatic test equipment and test programs that are used for product testing and design verification. They also may support the test development of the test equipment and processes to ensure robust and high quality test solutions and final products are realized.

Responsible for developing, implementing, and overseeing comprehensive test processes for electronic components and fully assembled products. Core duties include executing board-level diagnostics (ICT, Functional, and RF testing) and managing assembly-level validation, including burn-in processes and end-of-line (EOL) testing, to ensure maximum product reliability and quality compliance prior to shipment.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Unassisted, define, specify, qualify, install, support and optimize test process and test equipment solutions for manufacturing.                
• Lead test process optimization, with a focus on productivity improvements to cycle time and yield for a broad set of test equipment within an Operations value stream.                         
• Debug of test process and equipment solutions using design of experiments, tools, and failure analysis methodologies              
• Collaborate with Quality, Process and Equipment engineers to detect and solve product and test yield and performance issues               
• Develop improvement roadmaps for test coverage, diagnosability, reparability, test time reductions and OEE
• Analyzing and interpreting data and information from yield reports and equipment logs and product diagnostics to determine sources of yield loss               
• Provide solution support to Process Engineers to improve detection of known defect types as part of a Process Control plan                 
• Support development of test equipment integration into Manufacturing Execution Systems including yield, tester log and product parametric information. 
   

Knowledge/Skills/Competencies

Key Competencies:

• Board-Level Testing: In-Circuit Testing (ICT), Functional Testing (FCT), and Radio Frequency (RF) testing, Hi-Pot.
• Assembly-Level Testing: System integration testing and final product validation, Burn-in testing for early failure detection and End-of-Line (EOL) testing.

Physical Demands

• Duties of this position are performed in a normal office environment.
• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data. 
• Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.
• Occasional travel may be required.

Typical Experience

• 1 to 3 years.

Typical Education

• Bachelor degree or consideration of an equivalent combination of education and experience.
• Educational Requirements may vary by Geography

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.